MIL-STD-810F Method 501.4 - High Temperature

High temperatures may temporarily or permanently impair the performance of the test item by changing the physical properties or dimensions of the material composing it. Examples of some other problems that could occur as the result of high temperature exposure are as follows:

1. Parts binding from differential expansion of dissimilar materials.
2. Materials changing in dimension, either totally or selectively.
3. Gaskets displaying permanent set.
4. Closure and sealing strips deteriorating.
5. Fixed-resistance resistors changing in values.
6. Electronic circuit stability varying with differences in temperature gradients and differential expansion of dissimilar materials.
7. Transformers and electromechanical components overheating.
8. Shortened operating lifetime.
9. High pressures created within sealed cases.
10. Discoloration, cracking or crazing of organic materials.

The Trimble Recon is tested to the Hot Dry (A1) and Hot Humid (B3) conditions of seven 24-hour cycles at 65° C (149° F).