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Trimble and Infineon Introduce Smallest and Lowest Power GPS Solution
for Mobile, Automotive and Consumer Applications
SUNNYVALE, Calif., Oct. 25, 2000 -- Trimble (NASDAQ:TRMB) and Infineon Technologies (FSE/NYSE:IFX) today announced the smallest and lowest power integrated chipset and software solution for Global Positioning System (GPS) applications. The solution, based on Trimble's FirstGPSTM technology, allows high-volume manufacturers of consumer products to add GPS location with minimal impact on device size or battery life.
"Our combined efforts continue to lay the foundation for future generations of location-aware and communication-enabled consumer applications," said Steven W. Berglund, president and CEO of Trimble. "Infineon is a major player in several critical communication markets, such as GSM for the handset market. As the telematics market continues to emerge, the ability to combine Trimble GPS location and Infineon communication technologies at the integrated circuit and firmware levels will become even more important to the automotive industry."
"By combining our respective strengths, we can drive development in the GPS mass market," says Dr. Hermann Eul, general manager and vice president of the baseband ICs business unit at Infineon. "Our chipset is a vital part of this highly-integrated solution for high-volume, cost-effective GPS applications. This innovative hardware and software solution makes it possible to equip an even wider range of mobile devices with GPS functionality. We feel that the very small chip size and the ultra-low power consumption make our solution ideal for a range of applications, specifically mobile phone applications."
About the Product
The jointly developed 12-channel chipset and software solution is specifically designed for power-sensitive, wireless enabled, mobile information devices such as laptops, PDAs, digital cameras, smart phones, pagers and automobile navigation systems.
The technology offers the lowest power consumption of any GPS receiver on the market today. The chipset is comprised of one baseband ASIC and one RF ASIC. The baseband ASIC consumes less than 8 milliwatts and the RF ASIC less than 20 milliwatts. It is ideal for power-sensitive applications. For devices that only need location-on-demand, several sleep and low-power modes allow for further power savings and longer battery life. FirstGPS technology is also communication independent and capable of interfacing with a wide range of devices including AMPS, CDMA, TDMA, GSM, G3, CDPD and others.
Infineon's implementation of the baseband and RF ASICs is extremely compact. The baseband chip is packed in a 28-pin TSSOP (9.7mm x 6.4mm) and the RF chip in a 24-pin TSSOP (7.9mm x 6.4mm). The high level of integration translates to lower component count and enables a tiny footprint that is approximately one-sixth of a square inch for the entire chipset solution. This tiny footprint facilitates the integration of GPS functionality into a variety of mobile devices without adversely affecting product form factor and size.
For more information about Trimble's FirstGPS technology and Infineon's chipset visit: http://www.trimble.com/firstgps
Infineon's FirstGPS chipset is planned to be available in the fourth quarter of 2000.
Infineon Technologies AG, Munich, Germany, offers semiconductor solutions for applications in the wireless and wired communications markets, for the automotive and industrial sectors, for security systems and chip cards as well as memory products. With a global presence, Infineon operates in the US from San Jose, Calif., and in the Asia-Pacific region from Singapore. In the fiscal year 1999 (ending September), the company achieved sales of Euro 4.24 billion (US $ 4.51 billion) with about 26,000 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com
Founded in 1978, Trimble is a recognized worldwide leader in the development of innovative Global Positioning System (GPS) technology-based products for a wide range of applications. Today, these advanced solutions combine GPS with wireless communications and sophisticated software to meet demanding applications in markets ranging from agriculture and construction to asset management, automotive and timing. Headquartered in Sunnyvale, Calif., Trimble provides end-users and OEMs with leading edge solutions backed by global leadership in innovation, exceptional experience and in depth applications knowledge as well as a reputation for excellence.
With its acquisition of Spectra Precision, a leading provider of construction lasers, machine control systems, optical surveying instruments and related software, Trimble now broadens its portfolio of positioning solutions for the engineering and construction, and agriculture markets.
Media Contact: LeaAnn McNabb of Trimble: 408-481-7808