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Trimble and Infineon Introduce Low-Power GPS Chipset in Smaller Package
New VQFN Chip Ideal for Handheld, Battery Operated Devices
NEW ORLEANS, March 17, 2003 -- Trimble (NASDAQ:TRMB) and Infineon Technologies (FSE/NYSE:IFX) today announced that their integrated Global Positioning System (GPS) chipset and software solution will be available in an even smaller package—a two-chip VQFN form factor less than a square centimeter. Based on Trimble's exclusive FirstGPS® technology, the VQFN chipset solution allows high-volume manufacturers of consumer products to easily and cost-effectively add GPS location capabilities with minimal impact on device size or battery life.
The announcement was made at CTIA Wireless 2003.
"As GPS is added to an increasing number of platforms, products and systems, Trimble and Infineon continue to drive the technology development curve by reducing the power and size of GPS chipsets," said Dennis Workman, vice president and general manager of Trimble's Component Technologies Division. "Our smallest, lowest power GPS chipset available, the VQFN chipset is ideal for the new small, highly integrated, battery powered mobile devices being developed today."
"The success of our initial chipset in automotive applications sets the stage for handheld applications which require much smaller packages," said Hubert Christl, general manager and vice president of the Local Area Wireless business unit at Infineon. "As space requirements for advanced battery powered devices decrease, the tiny VQFN chipset makes it easier for developers to integrate GPS functionality into a wide range of mobile devices."
About the Product
Almost half the size of the initial TSSOP chipset offering from Trimble and Infineon, the new 12-channel VQFN chipset and software solution is specifically designed for even smaller, power-sensitive, mobile information devices such as PDAs, laptops, digital cameras as well as automobile navigation systems.
The technology offers the lowest power consumption and smallest size of any GPS receiver on the market today. The chipset is comprised of one baseband ASIC and one RF ASIC. The baseband ASIC consumes less than 8 milliwatts and the RF ASIC less than 20 milliwatts. It is ideal for power-sensitive applications. FirstGPS technology is also communication independent and capable of interfacing with a wide range of mobile devices.
Infineon's implementation of the GPS baseband and RF ASICs is extremely compact. The baseband chip is packed in a 28-pin VQFN (6.5mm x 5.5mm - 35.75 sq mm) and the RF chip in a 24-pin VQFN (4.5mm x 3.5mm - 15.75 sq mm), both with a tiny 0.9 mm profile. The high level of integration enables a tiny footprint that is less than a centimeter square for the entire chipset solution. This tiny footprint facilitates the integration of GPS functionality into a variety of mobile devices without adversely affecting product form factor and size.
For more information about Trimble's FirstGPS technology and Infineon's chipset visit: www.trimble.com/firstgps.
The FirstGPS VQFN chipset is expected to be available in the fourth quarter of 2003.
Information about Infineon is available at: www.infineon.com.
Trimble is a leading innovator of Global Positioning System (GPS) technology. In addition to providing advanced GPS components, Trimble augments GPS with other positioning technologies as well as wireless communications and software to create complete customer solutions. Trimble's worldwide presence and unique capabilities position the Company for growth in emerging applications including surveying, automobile navigation, machine guidance, asset tracking, wireless platforms, and telecommunications infrastructure. Founded in 1978 and headquartered in Sunnyvale, Calif., Trimble has more than 2,000 employees in more than 20 countries worldwide.
Forward Looking Statements
The anticipated release date of the FirstGPS VQFN chipset and the features that it will contain when released are forward looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, and are made pursuant to the safe harbor provisions of the Securities Litigation Reform Act of 1995. These forward looking statements are subject to change, and actual results may differ from those set forth in this press release due to unanticipated production delays, supply disruptions or engineering rework or other risks and uncertainties. These other risks are detailed from time to time in reports filed with the SEC, including Trimble's annual report on Form 10-K. Undue reliance should not be placed on any forward-looking statement, contained herein. These statements reflect the Company's position as of the date of this release. The Company expressly disclaims any undertaking to release publicly any updates or revisions to any statements to reflect any change in the Company's expectations or any change of events, conditions, or circumstances on which any such statement is based.
Investor Relations: Investor Relations of Trimble: 408-481-6914
Media Contact: LeaAnn McNabb of Trimble: 408-481-7808